Contact structure in a memory device

ABSTRACT

Annular, linear, and point contact structures are described which exhibit a greatly reduced susceptibility to process deviations caused by lithographic and deposition variations than does a conventional circular contact plug. In one embodiment, a standard conductive material such as carbon or titanium nitride is used to form the contact. In an alternative embodiment, a memory material itself is used to form the contact. These contact structures may be made by various processes, including chemical mechanical planarization and facet etching.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 13/323,120, filed Dec. 12, 2011, which is scheduled to issue asU.S. Pat. No. 8,362,625 on Jan. 29, 2013, which is a continuation ofU.S. patent application Ser. No. 12/392,886, filed on Feb. 25, 2009,which issued as U.S. Pat. No. 8,076,783 on Dec. 13, 2011, which is acontinuation of U.S. patent application Ser. No. 10/334,999, filed onDec. 31, 2002, and issued as U.S. Pat. No. 7,504,730 on Mar. 17, 2009,which is a continuation of U.S. patent application Ser. No. 09/809,561,filed on Mar. 15, 2001, and issued as U.S. Pat. No. 6,563,156 on May 13,2003, which was allowed for reissue as U.S. patent application Ser. No.11/008,755, filed on Dec. 9, 2004 and issued as U.S. Pat. No. RE40,842on Jul. 14, 2009, U.S. Pat. No. 6,563,156 is a continuation-in-part ofU.S. patent application Ser. No. 09/617,297, filed on Jul. 14, 2000which issued as U.S. Pat. No. 6,440,837 on Aug. 27, 2002. Thedisclosures of which is hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION

The invention relates generally to the field of semiconductor devicesand fabrication and, more particularly, to memory elements and methodsfor making memory elements.

This section is intended to introduce the reader to various aspects ofart that may be related to various aspects of the present invention,which are described and/or claimed below. This discussion is believed tobe helpful in providing the reader with background information tofacilitate a better understanding of the various aspects of the presentinvention. Accordingly, it should be understood that these statementsare to be read in this light, and not as admissions of prior art.

Microprocessor-controlled integrated circuits are used in a wide varietyof applications. Such applications include personal computers, vehiclecontrol systems, telephone networks, and a host of consumer products. Asis well known, microprocessors are essentially generic devices thatperform specific functions under the control of a software program. Thisprogram is stored in a memory device coupled to the microprocessor. Notonly does the microprocessor access a memory device to retrieve theprogram instructions, it also stores and retrieves data created duringexecution of the program in one or more memory devices.

There are a variety of different memory devices available for use inmicroprocessor-based systems. The type of memory device chosen for aspecific function within a microprocessor-based system depends largelyupon what features of the memory are best suited to perform theparticular function. For instance, volatile memories, such as dynamicrandom access memories (DRAMs), must be continually powered in order toretain their contents, but they tend to provide greater storagecapability and programming options and cycles than non-volatilememories, such as read only memories (ROMs). While non-volatile memoriesthat permit limited reprogramming exist, such as electrically erasableand programmable “ROMs,” all true random access memories, i.e., thosememories capable of 10¹⁴ programming cycles are more, are volatilememories. Although one time programmable read only memories andmoderately reprogrammable memories serve many useful applications, atrue nonvolatile random access memory (NVRAM) would likely be needed tosurpass volatile memories in usefulness.

Efforts have been underway to create a commercially viable memory devicethat is both random access and nonvolatile using structure changingmemory elements, as opposed to the charge storage memory elements usedin most commercial memory devices. The use of electrically writable anderasable phase change materials, i.e., materials which can beelectrically switched between generally amorphous and generallycrystalline states or between different resistive states while incrystalline form, in memory applications is known in the art and isdisclosed, for example, in U.S. Pat. No. 5,296,716 to Ovshinsky et al.,the disclosure of which is incorporated herein by reference. TheOvshinsky patent is believed to indicate the general state of the artand to contain a discussion of the general theory of operation ofchalcogenide materials, which are a particular type of structurechanging material.

As disclosed in the Ovshinsky patent, such phase change materials can beelectrically switched between a first structural state, in which thematerial is generally amorphous, and a second structural state, in whichthe material has a generally crystalline local order. The material mayalso be electrically switched between different detectable states oflocal order across the entire spectrum between the completely amorphousand the completely crystalline states. In other words, the switching ofsuch materials is not required to take place in a binary fashion betweencompletely amorphous and completely crystalline states. Rather, thematerial may be switched in incremental steps reflecting changes oflocal order to provide a “gray scale” represented by a multiplicity ofconditions of local order spanning the spectrum from the completelyamorphous state to the completely crystalline state.

These memory elements are monolithic, homogeneous, and formed ofchalcogenide material typically selected from the group of Te, Se, Sb,Ni, and Ge. This chalcogenide material exhibits different electricalcharacteristics depending upon its state. For instance, in its amorphousstate the material exhibits a higher resistivity than it does in itscrystalline state. Such chalcogenide materials may be switched betweennumerous electrically detectable conditions of varying resistivity innanosecond time periods with the input of picojoules of energy. Theresulting memory element is truly non-volatile. It will maintain theintegrity of the information stored by the memory cell without the needfor periodic refresh signals, and the data integrity of the informationstored by these memory cells is not lost when power is removed from thedevice. The memory material is also directly overwritable so that thememory cells need not be erased, i.e., set to a specified startingpoint, in order to change information stored within the memory cells.Finally, the large dynamic range offered by the memory materialtheoretically provides for the gray scale storage of multiple bits ofbinary information in a single cell by mimicking the binary encodedinformation in analog form and, thereby, storing multiple bits of binaryencoded information as a single resistance value in a single cell.

The operation of chalcogenide memory cells requires that a region of thechalcogenide memory material, called the “active region,” be subjectedto a current pulse to change the crystalline state of the chalcogenidematerial within the active region. Typically, a current density ofbetween about 10⁵ and 10⁷ amperes/cm2 is needed. To obtain this currentdensity in a commercially viable device having at least one millionmemory cells, for instance, one theory suggests that the active regionof each memory cell should be made as small as possible to minimize thetotal current drawn by the memory device.

However, known fabrication techniques have not proven sufficient.Currently, chalcogenide memory cells are fabricated by first creating adiode in a semiconductor substrate. A lower electrode is created overthe diode, and a layer of dielectric material is deposited onto thelower electrode. A small opening is created in the dielectric layer. Asecond dielectric layer, typically of silicon nitride, is then depositedonto the dielectric layer and into the opening. The second dielectriclayer is typically about 40 Angstroms thick. The chalcogenide materialis then deposited over the second dielectric material and into theopening. An upper electrode material is then deposited over thechalcogenide material.

A conductive path is then provided from the chalcogenide material to thelower electrode material by forming a pore in the second dielectriclayer by a process known as “popping.” Popping involves passing aninitial high current pulse through the structure to cause the seconddielectric layer to breakdown. This dielectric breakdown produces aconductive path through the memory cell. Unfortunately, electricallypopping the thin silicon nitride layer is not desirable for a highdensity memory product due to the high current and the large amount oftesting time required. Furthermore, this technique may produce memorycells with differing operational characteristics, because the amount ofdielectric breakdown may vary from cell to cell.

The active regions of the chalcogenide memory material within the poresof the dielectric material created by the popping technique are believedto change crystalline structure in response to applied voltage pulses ofa wide range of magnitudes and pulse durations. These changes incrystalline structure alter the bulk resistance of the chalcogenideactive region. Factors such as pore dimensions (e.g., diameter,thickness, and volume), chalcogenide composition, signal pulse duration,and signal pulse waveform shape may affect the magnitude of the dynamicrange of resistances, the absolute endpoint resistances of the dynamicrange, and the voltages required to set the memory cells at theseresistances. For example, relatively thick chalcogenide films, e.g.,about 4000 Angstroms, result in higher programming voltage requirements,e.g., about 15-25 volts, while relatively thin chalcogenide layers,e.g., about 500 Angstroms, result in lower programming voltagerequirements, e.g., about 1-7 volts. Thus, to reduce the requiredprogramming voltage, one theory suggests reducing the volume of theactive region. Another theory suggests that the cross-sectional area ofthe pore should be reduced to reduce the size of the chalcogenideelement. In a thin chalcogenide film, where the pore width is on thesame order as the thickness of the chalcogenide film, the current haslittle room to spread, and, thus, keeps the active region small.

The present invention is directed to overcoming, or at least reducingthe affects of, one or more of the problems set forth above.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other advantages of the invention may become apparentupon reading the following detailed description and upon reference tothe drawings in which:

FIG. 1 illustrates a schematic depiction of a substrate containing amemory device which includes a memory matrix and peripheral circuitry;

FIG. 2 illustrates an exemplary schematic depiction of the memory matrixor array of FIG. 1;

FIG. 3 illustrates an exemplary memory cell having a memory element,such as a resistor, and an access device, such as a diode;

FIG. 4 illustrates a top view of a portion of a semiconductor memoryarray;

FIG. 5 illustrates a cross-sectional view of an exemplary memory cell atan early stage of fabrication;

FIG. 6, FIG. 7, and FIG. 8 illustrate the formation of a spacer and asmall pore for the exemplary memory element;

FIG. 9 illustrates the small pore of the memory element;

FIG. 10 and FIG. 11 illustrate the formation of an electrode in thesmall pore;

FIG. 12 illustrates the deposition of memory material over the lowerelectrode;

FIG. 13 illustrates the deposition of the upper electrode of the memorycell;

FIG. 14 illustrates the deposition of an insulative layer and an oxidelayer over the upper electrode of the memory cell;

FIG. 15 illustrates the formation of a contact extending through theoxide and insulative layer to contact the upper electrode;

FIG. 16 illustrates a flow chart depicting an illustrative method offabricating an annular contact;

FIG. 17 illustrates a conductive layer over a substrate;

FIG. 18 illustrates a dielectric layer on the structure of FIG. 17;

FIG. 19 illustrates a window or trench in the dielectric layer of FIG.18;

FIG. 20 illustrates a conductive or chalcogenide layer on the structureof FIG. 19;

FIG. 21 illustrates a dielectric layer on the structure of FIG. 20;

FIG. 22 illustrates the formation of a contact by removal of thedielectric layer from the surface of the structure of FIG. 21;

FIG. 23 illustrates a top view of the structure of FIG. 22;

FIG. 24 illustrates a chalcogenide layer and a conductive layer on thestructure of FIG. 22;

FIG. 25 illustrates an alternative embodiment;

FIGS. 26 through 33 illustrate the formation of linear electrodes usingprocesses similar to those used in reference to FIGS. 16 through 25;

FIGS. 34 through 38 illustrate the formation of electrodes using facetetch processes;

FIGS. 39 through 41 illustrate the formation of a first electrodeembodiment using facet etch processes; and

FIGS. 42-46 illustrate the formation of a second electrode embodimentusing facet etch processes.

DETAILED DESCRIPTION

Specific embodiments of memory elements and methods of making suchmemory elements are described below as they might be implemented for usein semiconductor memory circuits. In the interest of clarity, not allfeatures of an actual implementation are described in thisspecification. It should be appreciated that in the development of anysuch actual implementation (as in any semiconductor engineeringproject), numerous implementation-specific decisions must be made toachieve the developers' specific goals, such as compliance withsystem-related and business-related constraints, which may vary from oneimplementation to another. Moreover, it should be appreciated that sucha development effort might be complex and time-consuming, but wouldnevertheless be a routine undertaking of semiconductor design andfabrication for those of ordinary skill having the benefit of thisdisclosure.

Turning now to the drawings, and referring initially to FIG. 1, a memorydevice is illustrated and generally designated by a reference numeral10. The memory device 10 is an integrated circuit memory that isadvantageously formed on a semiconductor substrate 12. The memory device10 includes a memory matrix or array 14 that includes a plurality ofmemory cells for storing data, as described below. The memory matrix 14is coupled to periphery circuitry 16 by the plurality of control lines18. The periphery circuitry 16 may include circuitry for addressing thememory cells contained within the memory matrix 14, along with circuitryfor storing data in and retrieving data from the memory cells. Theperiphery circuitry 16 may also include other circuitry used forcontrolling or otherwise insuring the proper functioning of the memorydevice 10.

A more detailed depiction of the memory matrix 14 is illustrated in FIG.2. As can be seen, the memory matrix 14 includes a plurality of memorycells 20 that are arranged in generally perpendicular rows and columns.The memory cells 20 in each row are coupled together by a respectiveword line 22, and the memory cells 20 in each column are coupledtogether by a respective digit line 24. Specifically, each memory cell20 includes a word line node 26 that is coupled to a respective wordline 22, and each memory cell 20 includes a digit line node 28 that iscoupled to a respective digit line 24. The conductive word lines 22 anddigit lines 24 are collectively referred to as address lines. Theseaddress lines are electrically coupled to the periphery circuitry 16 sothat each of the memory cells 20 can be accessed for the storage andretrieval of information.

FIG. 3 illustrates an exemplary memory cell 20 that may be used in thememory matrix 14. The memory cell 20 includes a memory element 30 whichis coupled to an access device 32. In this embodiment, the memoryelement 30 is illustrated as a programmable resistive element, and theaccess device 32 is illustrated as a diode. Advantageously, theprogrammable resistive element may be made of a chalcogenide material,as will be more fully explained below. Also, the diode 32 may be aconventional diode, a zener diode, or an avalanche diode, depending uponwhether the diode array of the memory matrix 14 is operated in a forwardbiased mode or a reverse biased mode. As illustrated in FIG. 3, thememory element 30 is coupled to a word line 22, and the access device iscoupled to a digit line 24. However, it should be understood thatconnections of the memory element 20 may be reversed without adverselyaffecting the operation of the memory matrix 14.

As mentioned previously, a chalcogenide resistor may be used as thememory element 30. A chalcogenide resistor is a structure changingmemory element because its molecular order may be changed between anamorphous state and a crystalline state by the application of electricalcurrent. In other words, a chalcogenide resistor is made of a statechangeable material that can be switched from one detectable state toanother detectable state or states. In state changeable materials, thedetectable states may differ in their morphology, surface typography,relative degree of order, relative degree of disorder, electricalproperties, optical properties, or combinations of one or more of theseproperties. The state of a state changeable material may be detected bymeasuring the electrical conductivity, electrical resistivity, opticaltransmissivity, optical absorption, optical refraction, opticalreflectivity, or a combination of these properties. In the case of achalcogenide resistor specifically, it may be switched between differentstructural states of local order across the entire spectrum between thecompletely amorphous state and the completely crystalline state. Thepreviously mentioned Ovshinsky patent contains a graphicalrepresentation of the resistance of an exemplary chalcogenide resistoras a function of voltage applied across the resistor. It is not unusualfor a chalcogenide resistor to demonstrate a wide dynamic range ofattainable resistance values of about two orders of magnitude. When thechalcogenide resistor is in its amorphous state, its resistance isrelatively high. As the chalcogenide resistor changes to its crystallinestate, its resistance decreases.

As discussed in the Ovshinsky patent, low voltages do not alter thestructure of a chalcogenide resistor, while higher voltages may alterits structure. Thus, to “program” a chalcogenide resistor, i.e., toplace the chalcogenide resistor in a selected physical or resistivestate, a selected voltage in the range of higher voltages is appliedacross the chalcogenide resistor, i.e., between the word line 22 and thedigit line 24. Once the state of the chalcogenide resistor has been setby the appropriate programming voltage, the state does not change untilanother programming voltage is applied to the chalcogenide resistor.Therefore, once the chalcogenide resistor has been programmed, a lowvoltage may be applied to the chalcogenide resistor, i.e., between theword line 22 and the digit line 24, to determine its resistance withoutchanging its physical state. As mentioned previously, the addressing,programming, and reading of the memory elements 20 and, thus, theapplication of particular voltages across the word lines 22 and digitlines 24, is facilitated by the periphery circuitry 16.

The memory cell 20, as illustrated in FIG. 3, may offer significantpackaging advantages as compared with memory cells used in traditionalrandom access and read only memories. This advantage stems from the factthat the memory cell 20 is a vertically integrated device. In otherwords, the memory element 30 may be fabricated on top of the accessdevice 32. Therefore, using the memory cell 20, it may be possible tofabricate a cross-point cell that is the same size as the crossing areaof the word line 22 and the digit line 24, as illustrated in FIG. 4.However, the size of the access device 32 typically limits the area ofthe memory cell 20, because the access device 32 must be large enough tohandle the programming current needed by the memory element 30.

As discussed previously, to reduce the required programming current,many efforts have been made to reduce the pore size of the chalcogenidematerial that forms the memory element 30. These efforts have been madein view of the theory that only a small portion of the chalcogenidematerial, referred to as the “active region,” is structurally altered bythe programming current. However, it is believed that the size of theactive region of the chalcogenide memory element 30 may be reduced byreducing the size of an electrode which borders the chalcogenidematerial. By reducing the active region and, thus, the requiredprogramming current, the size of the access device may be reduced tocreate a cross-point cell memory.

To make a commercially viable semiconductor memory array having aplurality of such memory cells, such memory cells should be reproducibleso that all memory cells act substantially the same. As alluded toearlier, by controlling the active region of the chalcogenide materialof each memory cell, a memory array of relatively uniform memory cellsmay be created. To control the active region, the contact area betweenthe chalcogenide and one or both of its electrodes may be controlled,and/or the volume of the chalcogenide material may be controlled.However, as described next, one technique for creating a substantiallycircular memory element using chalcogenide material, which produces goodresults, may nonetheless be improved upon to create memory cells havingmore uniformity. Before discussing these improvements, however, it isimportant to understand the technique for creating a substantiallycircular memory element.

This technique for creating a circular non-volatile memory elementgenerally begins with a small photolithographically defined feature.This feature, a circular hole, is reduced in circumference by adding anon-conductive material, such as a dielectric, to its sidewalls. Theresulting smaller hole serves as a pattern for a pore that holds anelectrode and/or the structure changing memory material. In either case,the final contact area between the structure changing memory materialand the electrode is approximately equal to the circular area of thesmaller hole.

The actual structure of an exemplary memory cell 20 is illustrated inFIG. 15, while a method for fabricating the memory cell 20 is describedwith reference to FIGS. 5-15. It should be understood that while thefabrication of only a single memory cell 20 is discussed below,thousands of similar memory cells may be fabricated simultaneously.Although not illustrated, each memory cell is electrically isolated fromother memory cells in the array in any suitable manner, such as by theaddition imbedded field oxide regions between each memory cell.

In the interest of clarity, the reference numerals designating the moregeneral structures described in reference to FIGS. 1-4 will be used todescribe the more detailed structures illustrated in FIGS. 5-15, whereappropriate. Referring first to FIG. 5, the digit lines 24 are formed inor on a substrate 12. As illustrated in FIG. 5, the digit line 24 isformed in the P-type substrate 12 as a heavily doped N+ type trench.This trench may be strapped with appropriate materials to enhance itsconductivity. The access device 32 is formed on top of the digit line24. The illustrated access device 32 is a diode formed by a layer of Ndoped polysilicon 40 and a layer of P+ doped polysilicon 42. Next, alayer of insulative or dielectric material 44 is disposed on top of theP+ layer 42. The layer 44 may be formed from any suitable insulative ordielectric material, such as silicon nitride.

The formation of a small pore in the dielectric layer 44 is illustratedwith reference to FIGS. 5-9. First, a hard mask 46 is deposited on topof the dielectric layer 44 and patterned to form a window 48, asillustrated in FIG. 6. The window 48 in the hard mask 46 isadvantageously as small as possible. For instance, the window 48 may beformed at the photolithographic limit by conventional photolithographictechniques. The photolithographic limit, i.e., the smallest feature thatcan be patterned using photolithographic techniques, is currently about0.18 micrometers. Once the window 48 has been formed in the hard mask46, a layer of spacer material 50, such as silicon dioxide, is depositedover the hard mask 46 in a conformal fashion so that the upper surfaceof the spacer material 50 is recessed where the spacer material 50covers the window 48.

The layer of spacer material 50 is subjected to an anisotropic etchusing a suitable etchant, such as CHF3. The rate and time of the etchare controlled so that the layer of spacer material 50 is substantiallyremoved from the upper surface of the hard mask 48 and from a portion ofthe upper surface of the dielectric layer 44 within the window 48,leaving sidewall spacers 52 within the window 48. The sidewall spacers52 remain after a properly controlled etch because the verticaldimension of the spacer material 50 near the sidewalls of the window 48is approximately twice as great as the vertical dimension of the spacermaterial 50 on the surface of the hard mask 46 and in the recessed areaof the window 48.

Once the spacers 52 have been formed, an etchant is applied to thestructure to form a pore 54 in the dielectric layer 44, as illustratedin FIG. 8. The etchant is an anisotropic etchant that selectivelyremoves the material of the dielectric layer 44 bounded by the spacers52 until the P+ layer 42 is reached. As a result of the fabricationmethod to this point, if the window 48 is at the photolithographiclimit, the pore 54 is smaller than the photolithographic limit, e.g., onthe order of 0.06 micrometers. After the pore 54 has been formed, thehard mask 46 and the spacers 52 may be removed, as illustrated in FIG.9. The hard mask 46 and the spacers 52 may be removed by any suitablemethod, such as by etching or by chemical mechanical planarization(CMP).

The pore 54 is then filled to a desired level with a material suitableto form the lower electrode of the chalcogenide memory element 30. Asillustrated in FIG. 10, a layer of electrode material 56 is depositedusing collimated physical vapor deposition (PVD). By using collimatedPVD, or another suitable directional deposition technique, the layer ofelectrode material 56 is formed on top of the dielectric layer 44 andwithin the pore 54 with substantially no sidewalls. Thus, the layer ofelectrode material 56 on top of the dielectric layer 44 may be removed,using CMP for instance, to leave the electrode 56 at the bottom of thepore 54, as illustrated in FIG. 11. It should be understood that theelectrode material 56 may be comprised of one or more materials, and itmay be formed in one or more layers. For instance, a lower layer ofcarbon may be used as a barrier layer to prevent unwanted migrationbetween the subsequently deposited chalcogenide material and the P+ typelayer 42. A layer of titanium nitride (TiN) may then be deposited uponthe layer of carbon to complete the formation of the electrode 56.

After the lower electrode 56 has been formed, a layer of chalcogenidematerial 58 may be deposited so that it contacts the lower electrode 56,as illustrated in FIG. 12. If the lower electrode 56 is recessed withinthe pore 54, a portion of the chalcogenide material 58 will fill theremaining portion of the pore 54. In this case, any chalcogenidematerial 58 adjacent the pore 54 on the surface of the dielectric layer44 may be removed, using CMP for instance, to create a chalcogenideelement of extremely small proportions. Alternatively, if the lowerelectrode 56 completely fills the pore 54, the chalcogenide material 58adjacent the pore 54 may remain, because the extremely small size of thelower electrode 56 still creates a relatively small active area in avertical direction through the chalcogenide material 58. Because of thischaracteristic, even if the lower electrode 56 only partially fills thepore 54, as illustrated, the excess chalcogenide material 58 adjacentthe pore 54 need not be removed to create a memory element 30 having anextremely small active area.

Regardless of which alternative is chosen, the upper electrode 60 isdeposited on top of the chalcogenide material 58, as illustrated in FIG.13. After the upper electrode 60, the chalcogenide material 58, thedielectric layer 44, and the access device 32 have been patterned andetched to form an individual memory cell 20, a layer of insulativematerial 62 is deposited over the structure, as illustrated in FIG. 14.A layer of oxide 64 is then deposited over the insulative layer 62.Finally, the oxide layer 64 is patterned and a contact hole 66 is formedthrough the oxide layer 64 and the insulative layer 62, as illustratedin FIG. 15. The contact hole 66 is filled with a conductive material toform the word line 22.

Although this technique, as previously mentioned, produces good results,there can be substantial variation in size of the many circular pores 54formed to create the memory cell array. Lithographic variations duringthe formation of a structure such as the one described above aretypically in the range of ±10% of the lithographic feature, i.e., ±10%of the diameter of the window 48. A variation in circular area (ΔAf)with respect to the intended circular area (Af) is approximately equalto:

$\begin{matrix}{\frac{\Delta\; A_{f}}{A_{f}} \approx {\frac{\Delta\; R_{i}}{R_{i}}( \frac{2R_{i}}{R_{f}} )}} & {{Equation}\mspace{14mu} 1}\end{matrix}$

where R_(i) represents the initial radius of the window 48, and R_(f)represents the final radius of the pore 54, and ΔR_(i) represents thevariation in the radius R_(i) due to, for example, photolithography andpattern transfer. Photolithographic deviations in pore formation cancause a variation in actual contact area versus intended contact areathat is approximately equal to the variation in actual radius of thewindow 48 versus the desired radius of the window 48 multiplied by twicethe ratio of the variation in the actual radius versus desired radius.Similarly, deposition thickness deviations during formation of thespacers 52 are typically in the range of ±10% of the deposited layer'sthickness. A variation in circular contact area (ΔA_(f)) with respect tothe intended circular contact area (A_(f)) is approximately equal to:

$\begin{matrix}{\frac{\Delta\; A_{f}}{A_{f}} \approx {\frac{\Delta\; h_{s}}{h_{s}}( {2 - \frac{2R_{i}}{R_{f}}} )}} & {{Equation}\mspace{14mu} 2}\end{matrix}$

where h_(s) represents the thickness of the spacer 52, Δh_(s) representsthe variation in the thickness of the spacer 52, and R_(i) and R_(f) aredefined above. Deposition deviations in spacer thickness can cause avariation in actual circular contact area versus intended contact areathat is approximately equal to the variation in spacer thickness versusthe desired spacer thickness multiplied by a number greater than zerowhich is dependent upon the initial and final contact hole radius.

Because of photolithographic and deposition variations duringprocessing, such as those discussed above, the reproducibility of smallcircular contacts between different elements in a semiconductor circuitcan suffer. To enhance the uniformity and reproducibility of contactsbetween different elements in a semiconductor circuit, an annularcontact structure, which exhibits a greatly reduced susceptibility toprocess variations, may be implemented. However, before discussing anexemplary implementation, the reduced susceptibility to processvariations will first be explained using many of the terms defined abovefor clarity and comparison.

Area variation (ΔA_(f)) for an annular contact which is thin withrespect to the intended contact area (A_(f)) is approximately equal tothe ratio of the variation in the initial contact hole's radius versusthe desired initial contact hole radius,

$\begin{matrix}{\frac{\Delta\; A_{f}}{A_{f}} \approx \frac{\Delta\; R_{i}}{R_{i}}} & {{Equation}\mspace{14mu} 3}\end{matrix}$

where R_(i) represents the circular window's initial radius before anannular contact is formed, and ΔR_(i) represents the variation in theannular contact's radius as a result of forming the annulus.

Similarly, deviations in deposition thickness of an annular contactstructure cause a variation in contact area (ΔA_(f)) versus intendedarea (A_(f)) that is approximately equal to the variation in annulusthickness versus the desired annulus thickness,

$\begin{matrix}{\frac{\Delta\; A_{f}}{A_{f}} \approx \frac{\Delta\; h_{A}}{h_{A}}} & {{Equation}\mspace{14mu} 4}\end{matrix}$

where h_(A) represents annulus thickness, and Δh_(A) represents thevariation in annulus thickness.

Comparison of Equation 3 with Equation 1 demonstrates that a thinannular contact structure exhibits less deviation due to lithographicvariations than does a circular contact structure having an equal area:

$\frac{\Delta\; A_{A}}{A_{f}} \approx \frac{\Delta\; R_{i}}{R_{i}}$ and$\frac{\Delta\; A_{C}}{A_{f}} \approx {\frac{\Delta\; R_{i}}{R_{i}}{( \frac{2R_{i}}{R_{f}} ).}}$Since R_(i) is always greater than R_(f),

$\begin{matrix}{{\frac{\Delta\; R_{i}}{R_{i}}} < {{\frac{\Delta\; R_{i}}{R_{i}}( \frac{2R_{i}}{R_{f}} )}}} & {{Equation}\mspace{14mu} 5}\end{matrix}$Thus,

$\begin{matrix}{{\frac{\Delta\; A_{A}}{A_{f}}} < {\frac{\Delta\; A_{C}}{A_{f}}}} & {{Equation}\mspace{14mu} 6}\end{matrix}$

Here, A_(f) represents the final or desired contact area, ΔA_(A)represents the variation in the annular contact area, ΔA_(c) representsthe variation in the circular contact area, R_(i) represents the contacthole's initial radius, R_(f) represents the contact hole's final radius,ΔR_(i) represents the variation in the contact hole's radius due to, forexample, lithographic and pattern transfer operations, and ∥ representsan absolute value operation.

Likewise, a comparison of Equation 4 and Equation 2 demonstrates that athin annular contact structure, which would correspond in area to acircular contact with final radius less than approximately two-thirdsthe initial radius, exhibits less deviation due to deposition variationsthan does the corresponding circular contact structure:

$\begin{matrix}{{\frac{\Delta\; A_{A}}{A_{f}} \approx \frac{\Delta\; h_{A}}{h_{A}}}{and}{\frac{\Delta\; A_{C}}{A_{f}} \approx {\frac{\Delta\; h_{s}}{h_{s}}( {2 - \frac{2R_{i}}{R_{f}}} )}}{{Where},{R_{r} < {\frac{2}{3}R_{i}}}}{{\frac{\Delta\; h_{A}}{h_{A}}} < {{\frac{\Delta\; h_{s}}{h_{s}}( {2 - \frac{2R_{i}}{R_{f}}} )}}}} & {{Equation}\mspace{14mu} 7}\end{matrix}$

From fabrication experience it is observed that

$\frac{\Delta\; h_{A}}{h_{A}} \approx \frac{\Delta\; h_{s}}{h_{s}}$for a large variety of materials over a large range of thicknesses.Thus,

$\begin{matrix}{{\frac{\Delta\; A_{A}}{A_{f}}} < {\frac{\Delta\; A_{C}}{A_{f}}}} & {{Equation}\mspace{14mu} 8}\end{matrix}$where all symbols retain their previous definitions.

Thus, as compared to small sublithographic circular contacts, a contactstructure having a thin annular geometry provides a more reproduciblefeature. That is, starting from the same lithographic feature, i.e., acontact hole or window, and ending with the same contact area, a thinannular contact should have less variation in contact area than acomparable circular contact. Furthermore, due to the relatively widecontact hole of the annular contact, it is easier to produce a conformalannular contact than it is a void-free circular contact. Also, theannular extent may be greater for less susceptibility to being blockedby particles.

Turning again to the drawings, and referring to FIG. 16, a flowchart 100depicts one method for forming a thin annular contact structure. Byfurther referring to FIGS. 17-25, in conjunction with the method setforth in the flowchart 100, there is illustrated a semiconductor device,in various stages of fabrication, in which a thin annular contactstructure is formed.

Referring first to block 102 and FIG. 17, a semiconductor substrate 104is provided. The substrate 104 may contain various device structuresthat have not been illustrated for the sake of clarity. For instance,the substrate 104 may include a digit line and an access device, such asthe digit line and the access device 32 described above with referenceto FIGS. 5-15. A conductive layer 106 is deposited onto the substrate104. This conductive layer 106 may be deposited in any suitable manner,such as by physical or chemical vapor deposition. The conductive layer106 may be comprised of one or more layers, and it may include one ormore materials. For instance, if the conductive layer 106 is to be usedas the bottom electrode for a chalcogenide memory element, theconductive layer 106 may include a layer of titanium nitride depositedon the substrate 104, with a layer of carbon deposited on the layer oftitanium nitride to prevent unwanted migration between the subsequentlydeposited chalcogenide material and the substrate 104.

Referring next to block 108 and FIG. 18, a first insulating layer 110 isformed on top of the conductive layer 106. The insulating layer 110 maybe formed in any suitable manner, such as by CVD. The material used forthe first insulating layer 110 can be, for example, a relatively thicklayer of boron and phosphorous doped silicon dioxide glass (BPSG), whichmay be advantageous for deep contacts, e.g., contact holes having adepth greater than their diameter. Alternatively, the material used forthe first insulating layer 110 could be undoped silicon dioxide orsilicon nitride, which may be advantageous for shallow contacts, e.g.,contact holes having a depth less than their diameter. As will bediscussed below, using silicon nitride as the material for the firstinsulating layer 110 may provide a further benefit in that it can serveas a CMP stop material.

Referring now to block 112 and FIG. 19, a contact hole or window 114 isformed through the insulating layer 110 to expose a portion of theunderlying conductive layer 106. Again, any suitable method of formingthe window 114 may be used. For instance, using standardphotolithographic techniques, a hard mask (not shown) may be depositedon top of the insulating layer 110 and patterned in the size and shapeof the resulting window 114, advantageously at the photolithographiclimit. An etchant may then be applied to remove the insulating materialunder the patterned hard mask to form the window 114. After etching, thehard mask is removed. However, the window 114 may also be fabricated tobe smaller than the photolithographic limit by using spacer technology,as described previously with reference to FIGS. 6-9.

As can be seen in block 116 and FIG. 20, a thin film 118 is disposedover the insulating layer 110 and the window 114. The thickness of thefilm 118 is small compared to the radius of the window 114. The film 118may be a conductive material, if an annular electrode is to be formed,or the film 118 may be a structure changing memory material, such aschalcogenide, if an annular memory element is to be formed. For thepurpose of clarity, the formation of an annular electrode will first bediscussed, followed by a discussion of the formation of an annularmemory element.

Generally speaking, any conductive material that is conformal to thewindow 114 and which has good adhesion properties for a subsequentlyformed insulating layer may be suitable to form the film 118. Exemplaryconductive materials may include titanium nitride, carbon, aluminum,titanium, tungsten, tungsten silicide, and copper, along withcombinations and alloys of these materials. A benefit of using carbon asthe conductive material is that it can serve as a mechanical stop for asubsequent CMP process described below.

Referring next to block 120 and FIG. 21, a second insulating layer 122is formed over the structure. In general, the thickness of the secondinsulating layer 122 is one to two times the depth of the contact hole114 for shallow contact holes. The same materials used to form the firstinsulating layer 110 may also be used to form the second insulatinglayer 122.

The second insulating layer 122 and the conductive film 118 are removedfrom the surface of the first insulating layer 110 to form an annularelectrode 124, as may be seen from a study of block 126 and FIGS. 22 and23. One technique for removing the second insulating layer 122 and theconductive film 118 on top of the layer 110 is the CMP process. The CMPprocess may be performed in one or more steps. For instance, if a CMPstop material, such as carbon, is used as the conductive film 118, or ifa layer of carbon is disposed on top of the layer 110, the CMP step maybe followed by an etch, such as a plasma-oxygen etch, for example, toremove any horizontally extending carbon that may be left in tact by theCMP operation. Alternatively, the layer 110 may be used as a CMP stop,so the conductive film 118 would not act as a CMP stop. Typicalconducting materials that may be used that are not natural CMP stopsinclude titanium nitride and tungsten silicide. Accordingly, in thisexample, an additional etching step would not be used.

If the annular electrode 124 is to be used as a bottom electrode of achalcogenide memory element, the remainder of the memory cell iscreated, as set forth in block 134. To create a memory cell, a layer ofchalcogenide 130 may be deposited over the annular electrode 124, andanother conductive layer or line 132 may be deposited over the layer ofchalcogenide 130, as illustrated in FIG. 24. In this example, thethickness of the layer of chalcogenide 130 is controlled, but the volumeof the layer of chalcogenide 130 is not controlled. In fact, the layerof chalcogenide 130 may be a blanket layer or a linear layer formed overother annular electrodes in the array. However, the contact area betweenthe annular electrode 124 and the layer of chalcogenide 130 iscontrolled well, which in turn controls the chalcogenide active region.Thus, an array of such memory cells should contain a plurality ofreproducible memory elements with uniform active regions. In view ofcurrent theory, such memory cells should operate in a uniform mannersuitable for a modern high density semiconductor memory.

Now, referring back to FIG. 20 and to block 140 of FIG. 16, theformation of an annular memory element will be discussed using the samereference numerals occasionally to refer to different materials thanthose discussed above for purposes of clarity. For instance, instead ofthe film 118 being composed of a conductive material, as discussedabove, the film 118 may be composed of a structure changing memorymaterial. Such memory material may be chalcogenide or any other suitablememory material. Such memory material should also be suitable forconformal deposition in the window 114 and demonstrate good adhesionproperties for a subsequently formed insulating layer.

Various types of chalcogenide materials may be used to form the film118. For example, chalcogenide alloys may be formed from tellurium,antimony, germanium, selenium, bismuth, lead, strontium, arsenic,sulfur, silicon, phosphorous, and oxygen. Advantageously, the particularalloy selected should be capable of assuming at least two generallystable states in response to a stimulus, for a binary memory, andcapable of assuming multiple generally stable states in response to astimulus, for a higher order memory. Generally speaking, the stimuluswill be an electrical signal, and the multiple states will be differentstates of crystallinity having varying levels of electrical resistance.Alloys that may be particularly advantageous include tellurium,antimony, and germanium having approximately 55 to 85 percent telluriumand 15 to 25 percent germanium, such as Te₅₆Ge₂₂ Sb₂₂.

Referring next to block 142 and FIG. 21, a second insulating layer 122is formed over the structure. In general, the thickness of the secondinsulating layer 122 is one to two times the depth of the contact hole114 for shallow contact holes. The same materials used to form the firstinsulating layer 110 may also be used to form the second insulatinglayer 122.

The second insulating layer 122 and the memory film 118 are removed fromthe surface of the first insulating layer 110 to form an annular memoryelement 124, as may be seen from a study of block 144 and FIGS. 22 and23. The second insulating layer 122 and the memory film 118 may beremoved by any suitable process, such as an etching process, CMPprocess, or combination thereof, to expose the annular memory element124.

In this case, the conductive layer 106 serves as the bottom electrode ofthe chalcogenide memory element. Therefore, a second conductive layer orline 146 may be deposited over the annular memory element 124, asillustrated in FIG. 25. In this example, the volume of the memory film118 is controlled well (possibly even better than in the priorembodiment), as is the contact area between the annular memory element124 and the second conductive layer 146. Thus, an array of such memoryelements should contain a plurality of reproducible memory cells withvery uniform active regions. In view of current theory, such memorycells should operate in a uniform manner suitable for a modern highdensity semiconductor memory.

To this point the discussion has centered around circular and annularcontact areas. However, many of the advantages that annular contactareas have as compared with circular contact areas may also be exhibitedby contact areas having different shapes. For instance, linear contactareas and hollow rectangular contact areas, as well as contact areashaving various other hollow geometric shapes, may be fabricated tocontrol the contact area and/or the volume of the memory material moreprecisely than known methods. For example, a hollow rectangular contactarea may be formed in virtually the same manner as described above withreference to FIGS. 16-25, the only major difference being that thewindow 114 should be patterned in a rectangular rather than a circularshape.

The formation of linear contact areas, on the other hand, may benefitfrom the following additional discussion which refers to FIGS. 26-33. Inthis discussion, it should be understood that the structures illustratedin FIGS. 26-33 may be formed using the materials and fabricationtechniques described above. Therefore, these details will not berepeated.

Rather than patterning a discrete window in an insulating layer, asillustrated in FIG. 19, a trench 150 may be patterned in a firstinsulating layer 152. As in the earlier embodiment, the first insulatinglayer 152 is disposed over a conductive layer 154 which is disposed on asubstrate 156. As can be seen in FIG. 27, a thin film 158 is disposedover the insulating layer 152 and the trench 150. As before, thethickness of the film 158 is advantageously small compared to the widthof the trench 150.

As in the previous embodiment, the film 158 may be a conductivematerial, if a linear electrode is to be formed, or the film 158 may bea structure changing memory material, such as chalcogenide, if a linearmemory element is to be formed. Again, for the purpose of clarity, theformation of a linear electrode will first be discussed, followed by adiscussion of the formation of a linear memory element.

If the film 158 is a conductive material, as described previously, asecond insulating layer 160 is formed over the structure. In general,the thickness of the second insulating layer 160 is one to two times thedepth of the trench 150 for shallow trenches. The second insulatinglayer 160 and the conductive film 158 are removed from the surface ofthe first insulating layer 152 to form two linear electrodes 162 and164, as may be seen from a study of FIGS. 28 and 29.

If the linear electrodes 162 and 164 are to be used as the bottomelectrodes for chalcogenide memory elements, the remainder of the memorycell is created. To create a memory cell, a layer of chalcogenide 166may be deposited over the linear electrodes 162 and 164, and anotherconductive layer 168 may be deposited over the layer of chalcogenide166. Then, the layers 166 and 168 may be patterned to create linearfeatures that are perpendicular to the linear electrodes 162 and 164, asillustrated in FIGS. 30 and 31. These features may have a width at orbelow the photolithographic limit. It should be noted that the patternedconductive layers 168 form word lines (the digit lines being formed inthe substrate 156) which are perpendicular to the linear electrodes 162and 164 to create an array of addressable memory cells. It should alsobe noted that the portions of the linear electrodes 162 and 164 betweenthe patterned conductive layers 168 may be removed, or otherwiseprocessed, to make each cell electrically distinct.

In this example, the contact area between the linear electrodes 162 and164 and the layer of chalcogenide 166 is controlled well and can besmaller than an annular contact area. Furthermore, an active region inthe layer of chalcogenide 166 can have less volume than the blanketlayer of chalcogenide 130 discussed previously. Thus, an array of suchmemory cells should contain a plurality of reproducible memory elementswith small, uniform active regions. In view of current theory, suchmemory cells should operate in a uniform manner suitable for a modernhigh density semiconductor memory.

Now, referring back to FIG. 27, the formation of a linear memory elementwill be discussed using the same reference numerals occasionally torefer to different materials than those discussed above for purposes ofclarity. For instance, instead of the film 158 being composed of aconductive material, as discussed above, the film 158 may be composed ofa structure changing memory material. Such memory material may bechalcogenide or any other suitable memory material. Such memory materialshould also be suitable for conformal deposition in the trench 150 anddemonstrate good adhesion properties for a subsequently formedinsulating layer.

Referring next to FIGS. 28 and 29, a second insulating layer 160 isformed over the structure, and the second insulating layer 160 and thememory film 158 are removed from the surface of the first insulatinglayer 152 to form two linear memory elements 162 and 164. In this case,the conductive layer 154 serves as the bottom electrode of thechalcogenide memory element. Therefore, a second conductive layer 170may be deposited over the linear memory elements 162 and 164 and etchedto form conductive lines substantially perpendicular to the linearmemory elements 162 and 164, as illustrated in FIGS. 32 and 33. As inthe previous embodiment, the portions of the linear memory elements 162and 164 between the conductive layers 170 may be removed, or otherwiseprocessed, to make each memory cell electrically distinct. In thisexample, the volume of the memory film 158 is controlled well, as is thecontact area between the linear memory elements 162 and 164 and thesecond conductive layer 170. Thus, an array of such memory elementsshould contain a plurality of reproducible memory cells with small andvery uniform active regions. In view of current theory, such memorycells should operate in a uniform manner suitable for a modern highdensity semiconductor memory.

It should be recognized that methods of fabricating contact structuresother than the methods described above may be utilized to fabricatesimilar contact structures. For instance, a “facet etch” process may beutilized to create similar contact structures without using a CMPprocess which may be damaging to the chalcogenide material or to thesmall features of the contact structure. Indeed, a facet etch processcan create structures that are difficult, if not impossible, to makeusing CMP. An example of a facet etch process is described below withreference to FIGS. 34-41. In this discussion, it should be understoodthat the structures illustrated in FIGS. 34-41 may be formed using thematerials and fabrication techniques described above, except as statedotherwise. Therefore, these details will not be repeated.

As illustrated in FIG. 34, a structure similar to the initial structureof the previous embodiments is formed. Specifically, a conductive layer180 is deposited over a substrate 182. A first insulating layer 184 isdeposited over the conductive layer 180, and a window or trench 186 isformed in the first insulating layer 184. Then, a conformal secondconductive layer 188 is deposited over the first insulating layer 184and over the window or trench 186.

Unlike the previously described embodiments, a thin conformal secondinsulating layer 190 is deposited over the conformal second conductivelayer 188, as illustrated in FIG. 35. A facet etch is then performed toremove portions of the second insulating layer 190 at the edges 192 ofthe window or trench 186, as shown in FIG. 36. A facet etch using anargon etchant, for example, can remove the second insulating layer 190from the edges 192 at a rate up to four times that which is removed atthe planar surfaces. It should be noted that this process leaves thesecond layer of insulating material 190 on the vertical and horizontalsurfaces of the window or trench 186. Thus, the facet etch creates ageometric contact, such as an annular or rectangular contact, if thefeature 186 is a window, and it creates a linear contact is the feature186 is a trench.

Once the second conductive layer 188 is exposed at the edges 192,subsequent layers may be deposited to complete a circuit. For example,the window or trench 186 may be filled with a layer of chalcogenide 194,as shown in FIG. 37. Note that contact between the chalcogenide layer194 and the second conductive layer 188 occurs only at the edges 192. Anupper electrode of conductive material 195 and other features may beformed over the layer of chalcogenide 194 to complete the memory celland memory array.

Alternatively, as with the previous embodiments, the layer 188illustrated in FIGS. 34-37 may be a layer of structure changingmaterial, such as chalcogenide. In this case, the facet etch removes theedges of the second insulating layer 190 to expose the corners 192 ofthe chalcogenide layer 188. Accordingly, rather than filling the windowor trench 186 with a layer of chalcogenide material, a second conductivelayer 196 is deposited, as illustrated in FIG. 38. As before, otherfeatures may be formed on the second conductive layer 196 to finish thecircuit.

It should be further appreciated that the facet etch process justdescribed may be used on protruding features, as well as the window ortrench 186. In contrast, the CMP process probably cannot be used onprotruding features with much success, and the CMP process may also haveproblems with trenches and other large shapes. As illustrated in FIG.39, a protruding feature 200 may be formed on a substrate 202. As withthe embodiments described above, the substrate 202 may contain featuresor circuitry, such as an access device. In one example, the protrudingfeature 200 may be a conductive pillar or line, depending on whether ageometric or linear contact is desired. A conformal insulating layer 204is deposited over the conductive pillar or line 200, and a facet etch isperformed to remove the edges of the insulating layer to expose theedges 206 of the conductive pillar or line 200, as illustrated in FIG.40. Once the edges 206 of the conductive pillar or line 200 have beenexposed to form a contact, a layer of chalcogenide 208 may be formedover the structure, as illustrated in FIG. 41. To complete the memorycell, a second layer of conductive material 210 may be formed over thechalcogenide layer 208.

Of course, the protruding feature 200 may be a chalcogenide pillar orline. In this example, the substrate 202 may also include a conductivelayer or layers which form the bottom electrode of a chalcogenide memorycell. Accordingly, after the insulating layer 204 has been deposited andthe edges removed to expose the edges 206 of the chalcogenide pillar orline 200, the layer 208 may be formed using a conductive material ormaterials to complete the memory cell and the layer 210 of FIG. 41 maybe omitted.

In addition to forming geometric or linear contacts, the facet etchprocess may also be utilized to form point contacts. As illustrated inFIGS. 42 and 43, a protruding feature 220 may be formed on a substrate222. As with the embodiments described above, the substrate 222 maycontain features or circuitry, such as an access device. In one example,the protruding feature 220 may be a conductive pillar. Advantageously,the conductive pillar has a shape with one or more corners 223, such asa square or rectangular shape. A conformal insulating layer 224 isdeposited over the conductive pillar 220, and a facet etch is performedto remove the corners of the insulating layer to expose the corners 226of the conductive pillar 220, as illustrated in FIGS. 44 and 45. If theconductive pillar 220 has a square or rectangular shape, the exposedcorners 226 of the conductive pillar 220 form four point contacts.

It should be appreciated that one, two, or four memory cells may befabricated using the four contact points. As a first example, each pointcontact may be utilized in an individual memory cell. In other words,chalcogenide material (as described in conjunction with the previousembodiments) may be formed over each of the four point contacts tocreate four separate memory cells, each with its own set of bit lines.As a second example, if the four point contacts are sufficiently closedto one another, all four point contacts may be covered with chalcogenidematerial and used in a single memory cell. As illustrated in FIG. 46, alayer of chalcogenide 228 may be formed over the structure, and a secondlayer of conductive material 230 may be formed over the chalcogenidelayer 228 to complete the memory cell. As a third example, two of thefour point contacts may be used in a first memory cell and the other twoof the four point contacts may be used in a second memory cell. In thisexample, it may be particularly useful to use a rectangular pillar 220so that one pair of point contacts is sufficiently spaced from the otherpair of point contacts to facilitate chalcogenide coverage of eachrespective pair of point contacts, as well as to facilitate theprovision of separate sets of bit lines for each pair of point contacts.

Of course, the protruding feature 220 may be a chalcogenide pillar. Inthis example, the substrate 222 may also include a conductive layer orlayers which form the bottom electrode of a chalcogenide memory cell.Accordingly, after the insulating layer 224 has been deposited and thecorners removed to expose the corners 226 of the chalcogenide pillar220. As described above, for a chalcogenide pillar 220 that yields fourpoint contacts, one, two, or four memory cells may be fabricated. Usingthe second example above in which a single memory cell is fabricatedusing four point contacts, the layer 228 may be formed using aconductive material or materials to complete the memory cell and thelayer 230 of FIG. 46 may be omitted.

Although the invention herein has been described with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent invention. It is therefore to be understood that numerousmodifications may be made to the illustrative embodiments and that otherarrangements may be devised without departing from the spirit and scopeof the present invention as defined by the appended claims.

Although the invention herein has been described with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent invention. It is therefore to be understood that numerousmodifications may be made to the illustrative embodiments and that otherarrangements may be devised without departing from the spirit and scopeof the present invention as defined by the appended claims.

The invention claimed is:
 1. A semiconductor device comprising: a firstconductive layer; a first insulative layer disposed on the firstconductive layer, wherein the first insulative layer comprises a contactopening formed through its entire thickness thereby terminating on thefirst conductive layer thereby providing a portion of the firstconductive layer with no first insulative material thereover; a secondconductive layer disposed on the first insulative layer, the portion ofthe first conductive layer where the opening terminates and over whichthere is no first insulative layer, and in the contact opening thesecond conductive material comprising at least one of titanium nitride,titanium, aluminum, tungsten, tungsten silicide, and copper; a secondinsulative layer disposed on the second conductive layer and in thecontact opening, wherein portions of the second conductive layer are notcovered by the second insulative layer; and a conductive materialdisposed on the second insulative layer and in the contact opening,wherein the conductive material is in direct contact with the portionsof the second conductive layer.
 2. The semiconductor device of claim 1,wherein the exposed portions of the second conductive layer form anannular contact.
 3. The semiconductor device of claim 1, wherein thefirst conductive layer comprises a lower electrode.
 4. Thesemiconductors device of claim 1, wherein the second conductive layercomprises an upper electrode.
 5. A semiconductor device comprising: afirst conductive layer disposed on a substrate; a first insulative layerdisposed on the first conductive layer, wherein the first insulativelayer has a contact opening formed through its entire thickness therebyexposing at least a portion of the first conductive layer; a secondconductive layer disposed on the first insulative layer on the exposedportion of the first conductive layer, and in the contact opening; and asecond insulative layer disposed on the second conductive layer and inthe contact opening, wherein at least portions of the second conductivelayer are not covered by the second insulative layer.
 6. Thesemiconductor device of claim 5, wherein the first conductive layercomprises a titanium nitride layer and a carbon layer deposited on thetitanium nitride layer.
 7. The semiconductor device of claim 5, whereinthe first insulative layer comprises boron and phosphorous doped silicondioxide glass (BPSG).
 8. The semiconductor device of claim 5, whereinthe contact opening comprises a depth and a diameter, and wherein thedepth is greater than the diameter.